EVS-3000 | Fanless AI Computing System
Features
Workstation-grade Platform: Intel® Core™ i9/i7/i5/i3 Processor running with Intel® R680E PCH supports max 65W TDP CPU
Supports up to a 115W compact NVIDIA® Quadro®/GeForce® MXM graphics card, which delivers with advanced NVIDIA® CUDA® cores.
Capable of accommodating 2 NVIDIA®/AMD graphics cards with a maximum power consumption of 200W
Up to 4 PCIe slots with: 2 PCIe x16 Slot with x4 signal, 1 PCIe x8 Slot with x8 signal
2 Front-access M.2 and 2 2.5" SSD Tray, 1 SIM Socket for wireless network
USB 3.2 Gen 2x2 offers max data transfer speeds of 20Gbps
Fanless operation in temperatures from -25°C to 55°C
DC 9V to 55V wide range power input with Software Ignition Control
Supports remote devices Out-of-Band management functions powered by Allxon
Overview
The EVS-3000 Series is a fanless AI computing system featuring the latest Intel Core i9/i7/i5/3 processors (14th Gen). It is equipped with advanced I/O capabilities, including USB Type-C, 2.5G LAN, and up to 4 PCIe slots for expansion. The series is equipped with up to 4 PCIe expansion slot that supports max 200W power of NVIDIA® or AMD graphics engine, ensuring high-performance computing in a robust and durable design. This makes it ideal for applications in autonomous robotics, machine vision, public security, and other edge AI scenarios.
The EVS-3000 series offers versatility with 8 different modules: EVS-3400(F), EVS-3300(F), EVS-3200(F), and EVS-3100(F), providing scalable solutions tailored to specific project needs. For efficient remote management, the series incorporates Out-of-Band management functions powered by Allxon, enhancing remote device management and boosting productivity.
Specifications
System
Processor
- 24-core Intel® Core™ i9/i7/i5/i3 Processor (14th gen, Raptor Lake-S Refresh)
- 24-core 13th Gen Intel® Core™ i9/i7/i5/i3 Processor (Raptor Lake-S)
- 16-core 12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Alder Lake-S)
Chipset
Intel® R680E Chipset
BIOS
AMI
SIO
IT8786E
Memory
2 DDR5 5600MHz SO-DIMM, up to 96GB (ECC/Non-ECC)
OS
Windows 11, Windows 10, Linux
I/O Interface
Serial
2 COM RS-232/422/485 (ESD 8kV)
USB
- 4 USB 3.2 Gen 2 Type A
- 1 USB 3.2 Gen 2x2, USB Type-C supports max 20Gbps data transfer (15W, 5V/3A)
Isolated DIO
32 Isolated DIO (16 DI, 16 DO)
LED
Power, HDD, OOB
SIM Card
1 External SIM Card Socket for 5G/4G/LTE/GPRS/UMTS wireless network
Expansion
PCIe
Up to 4 PCIe slots with:
- 2 PCIe x16 Slot with x4 signal
- 1 PCIe x8 Slot with x8 signal
M.2
- 1 M.2 Key B Socket (2280/3042/3052, PCIe/USB 3, default/SATA)
- 1 M.2 Key E Socket (2230, PCIe/USB)
Graphics
Graphics Processor
Intel® UHD Graphics 770/730 driven by Intel® Xe Architecture
Interface
Up to 7 independent displays:
- 2 HDMI 2.1: Up to 4096 x 2304 @60Hz
- 1 DP: Up to 3840 x 2160 @60Hz
- 4 DP: Up to 7680 x 4320 @60Hz (By requested MXM)
Storage
SATA
2 SATA III (6Gbps) support S/W RAID 0, 1, with 2 Front-access 2.5" SSD/HDD Tray
M.2
- 1 M.2 Key M Socket (2280, PCIe x4) - 2 Front-access M.2 Key M SSD Tray
Audio
Audio Codec
Realtek ALC888S-VD, 7.1 Channel HD Audio
Audio Interface
1 Mic-in, 1 Line-out
Ethernet
LAN 1
Intel® I226 2.5GigE LAN supports TSN
LAN 2
Intel® I226 2.5GigE LAN supports TSN
Power
Power Input
DC 9V to 55V
Power Interface
3-pin Terminal Block : V+, V-, Frame Ground
Ignition Control
16-mode Software Ignition Control
Remote Switch
3-pin Terminal Block
Out-of-Band Management
MCU
Nuvoton NUC980
Interface
OOB LAN, 10/100Mb Ethernet LAN, RJ45 Connector
Remote Management
Support Remote Power ON/OFF, Reset and Power Cycling
Others
TPM
Infineon SLB9670 supports TPM 2.0, SPI Interface
Watchdog Timer
Reset : 1 to 255 sec./min. per step
Smart Management
Wake on LAN, PXE supported
HW Monitor
Monitoring temperature, voltages. Auto throttling control when CPU overheats.
Mechanical
Dimension
EVS-3300: 280mm x 130mm x 215mm (11.02"x 5.19"x 8.46") EVS-3300F: 280mm x 137mm x 215mm (11.02"x 5.39"x 8.46")
Weight
EVS-3300: 6.2 kg (13.67 lb) EVS-3300F: 6.3 kg (13.89 lb)
Mounting
- Wallmount by mounting bracket
- VESA Mount (Optional)
- DIN Rail Mount (Optional)
- Rackmount (Optional)
Environment
Operating Temperature
- 35W TDP CPU: -25°C to 55°C (-13°F to 131°F) with air flow
- 65W TDP CPU: -25°C to 45°C (-13°F to 113°F) with air flow
Storage Temperature
-40°C to 85°C (-40°F to 185°F)
Humidity
5% to 95% Humidity, non-condensing
Relative humidity
95% at 55°C
Shock
- IEC 60068-2-27
- SSD: 50G @wallmount, Half-sine, 11ms
- MIL-STD-810G method 514.6, Category 4 (with PCIe Card)
Vibration
- IEC 60068-2-64
- SSD: 5Grms, 5Hz to 500Hz, 3 Axis
- MIL-STD-810G method 516.6, Procedure I (with PCIe Card)
EMC
CE, FCC, ICES, EN50155, EN50121-3-2