ECX-3000 PEG | Compact AI Computing System
Features
Workstation-grade Platform : Intel® Core™ i9/i7/i5/i3 Processor (14th gen, codename : RPL-S Refresh/RPL-S/ADL-S) running with Intel® R680E PCH supports max 65W TDP CPU
Supports outstanding AI computing productivity by NVIDIA®/AMD graphics card, up to 200W power budget
USB 3.2 Gen 2x2 offers a max speed of 20Gbps data transfer
DC 12V to 50V wide range power input, Software Ignition Control
4 Independent 2.5GigE LAN IEEE 802.3at PoE+, 2 GigE LAN
Supports multiple 5G/WiFi/BT/4G/LTE/GPRS/UMTS
Supports Intel® vPro, TCC, Time-Sensitive Networking (TSN), and TPM 2.0
Storage : 4 front-access 2.5" SSD Tray, M.2 Key M
Overview
Workstation-grade Platform : Intel® Core™ i9/i7/i5/i3 Processor (14th gen, codename : RPL-S Refresh/RPL-S/ADL-S) and running with Intel® R680E Chipset, Vecow ECX-3000 PEG Series delivers workstation-grade performance, with up to 36% CPU performance improved. The series is equipped with up to 4 PCIe expansion slot that supports max 200W power of NVIDIA® or AMD graphics engine and allows for expansions with 1 Mini PCIe and 2 M.2. Support for PCIe 4.0 and DDR5 4800HMz memory up to 64GB, Vecow ECX-3000 PEG Series offers a robust combination of performance and flexibility to facilitate AIoT applications such as Robotic Control, Smart Manufacturing, In-Vehicle Computing, and any Edge AI applications.
Specifications
System
Processor
- 24-core Intel® Core™ i9/i7/i5/i3 Processor (14th gen, Raptor Lake-S Refresh)
- 24-core 13th Gen Intel® Core™ i9/i7/i5/i3 Processor (Raptor Lake-S)
- 16-core 12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Alder Lake-S)
Chipset
Intel® R680E Chipset
BIOS
AMI
SIO
IT8786E
Memory
2 DDR5 4800MHz SO-DIMM, up to 64GB
OS
Windows 11, Windows 10, Linux
I/O Interface
Serial
4 COM RS-232/422/485
USB
- 6 USB 3.2 Gen 2, USB Type A Connector
- 1 USB 3.2 Gen 2x2, USB Type C Connector supports
max 20Gbps data transfer (15W, 5V/3A)
Isolated DIO
32 Isolated DIO (16 DI, 16 DO)
LED
Power, HDD, PoE, WLAN
SIM Card
3 External Nano SIM Card Socket
RTC Battery
1 Front-access RTC Battery
Expansion
Mini PCIe
1 Mini PCIe sockets for PCIe/USB/SIM Card
PCIe
4 PCIe Slot :
- 2 PCIe x16 Slot with x8 signal
- 2 PCIe x8 Slot with x4 signal
M.2
- 1 M.2 Key B Socket (3042/2280, PCIe/USB 3, default/USB 2)
- 1 M.2 Key B Socket (3052/2280, PCIe/USB 3, default/USB 2)
- 1 M.2 Key E Socket (2230, PCIe/USB)
Graphics
Graphics Processor
Intel® UHD Graphics 770/730 driven by Intel® Xe Architecture
Interface
- 1 DVI-I : Up to 1920 x 1080 @60Hz
- 1 HDMI : Up to 1920 ×1080 @60Hz
- 2 DisplayPort : Up to 7680 x 4320 @60Hz/5120 x 2880 @60Hz
- By requested Graphics Card
Storage
SATA
4 SATAIII (6Gbps) support software RAID 0,1,5,10
M.2
1 M.2 Key M Socket (2280, PCIe x4)
Storage Device
4 Front-access 2.5"SSD/HDD Tray
Audio
Audio Codec
Realtek ALC888S-VD, 7.1 Channel HD Audio
Audio Interface
1 Mic-in, 1 Line-out
Ethernet
LAN 1
Intel® I219LM GigE LAN
LAN 2
Intel® I210 GigE LAN
PoE
LAN 3
2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226, RJ45 Connector
LAN 4
2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226, RJ45 Connector
LAN 5
2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226, RJ45 Connector
LAN 6
2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226, RJ45 Connector
Power
Power Input
DC 12V to 50V
Power Interface
3-pin Terminal Block : V+, V-, Frame Ground
Ignition Control
16-mode Software Ignition Control
Remote Switch
3-pin Terminal Block
Others
TPM
Infineon SLB9670 supports TPM 2.0, SPI Interface
Watchdog Timer
Reset : 1 to 255 sec./min. per step
Smart Management
Wake on LAN, PXE supported
HW Monitor
Monitoring temperature, voltages. Auto throttling control when CPU overheats.
Mechanical
Dimension
260mm x 240mm x 142mm (10.24"x9.45"x5.59")
Weight
7.5 kg (16.53 lb)
Mounting
- Wallmount by mounting bracket
- VESA Mount (Optional), Rackmount (Optional)
Environment
Operating Temperature
-20°C to 45°C (-4°F to 113°F), with System Fan
Storage Temperature
-40°C to 85°C (-40°F to 185°F)
Humidity
5% to 95% Humidity, non-condensing
Relative humidity
95% at 45°C
Shock/Vibration
Operating, MIL-STD-810G, Procedure I
EMC
CE, FCC, EN50155, EN50121-3-2