ECX-3000 | High-Performance Fanless System

ECX-3000 DATASHEET

Rugged Fanless Industrial High-Performance Computer

Features
13th/12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Raptor Lake-S/Alder Lake-S) with intelligent workload optimization, up to 36% CPU performance improved
Intel® UHD Graphics 770 driven by Intel® Xe Architecture, with max 94% graphics performance and 181% GPU image classification inference performance enhanced
8 Independent 2.5G LAN with 4 IEEE 802.3at PoE+
4 Front-access M.2 SSD Tray, 6 USB 3.2 Gen 2
DC 9V to 50V Power Input, Software Ignition Control
Supports Intel® TPM 2.0 and Time-Sensitive Networking (TSN)
Optional VHub One-Stop AIoT Solution Service supports OpenVINO based AI accelerator and advanced Edge AI applications
Overview
Powered by 13th/12th Gen Intel® Core™ i9/i7/i5/i3 processor (Raptor Lake/Alder Lake) with Intel® 600 Series Chipset, fanless -40°C to 75°C operating temperature, multiple 10G LAN/2.5G LAN/GigE LAN/SIM socket configuration, max 6 USB 3.2 Gen 2 connections supporting up to 10Gbps data rate, outstanding system performance, 5G/WiFi 6/4G/3G/LTE/GPRS/UMTS mobile availability, 9V to 50V power input. Software ignition power control and rugged reliability in harsh environments, all-in-one integrated features, Vecow ECX-3000 Series Fanless Embedded System is your new generation choices for Machine Vision, In-vehicle Computing, Public Security, Factory Automation, Intelligent Transportation System (ITS), Robotic Control, AMR/AGV, Deep Learning, and any Edge AI applications.

Specifications

System

Processor	－24-core 13th Gen Intel® Core™ i9/i7/i5/i3 Processor (Raptor Lake-S) －16-core 12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Alder Lake-S)
Chipset	Intel® 600 Series
BIOS	AMI
SIO	IT8786E
Memory	2 DDR4 3200MHz SO-DIMM, up to 64GB (ECC/Non-ECC)
OS	Windows 10, Linux

I/O Interface

Expansion

Mini PCIe	1 Mini PCIe Socket for PCIe/USB/SIM Card/Optional mSATA
M.2	- 1 M.2 Key B Socket (3042/3052) - 1 M.2 Key E Socket (2230)
SUMIT A, B	2 SUMIT Slot (Optional)

Graphics

Graphics Processor	Intel® UHD Graphics 770 driven by Intel® Xe Architecture
Interface	4 independent displays : - 2 DisplayPort : Up to 7680 x 4320 @60Hz/5120 x 2880 @60Hz - 1 DVI-I : Up to 1920 x 1080 @60Hz - 1 HDMI : Up to 4096 x 2160 @60Hz

Storage

SATA	2 SATA III (6Gbps) support S/W RAID 0, 1
mSATA	1 SATA III (Mini PCIe Type, 6Gbps)
M.2	1 M.2 Key M Socket (2280, PCIe x4)
Storage Device	- Front-access 2.5" SSD/HDD Tray - 4 Front-access M.2 Key M SSD Tray (ECX-3000 PoES)

Audio

Audio Codec	Realtek® ALC888S-VD, 7.1 Channel HD Audio
Audio Interface	1 Mic-in, 1 Line-out

Ethernet

LAN 1	Intel® I219LM GigE LAN supports iAMT
LAN 2	Intel® I225 2.5GigE LAN supports TSN

2.5G PoE

2.5G Ethernet (ECX-3025R/3025)

10G Ethernet (ECX-3071XR/3071X)

LAN 7	Intel® X710-AT2 10GigE LAN
LAN 8	Intel® X710-AT2 10GigE LAN

Power

Power Input	DC 9V to 50V
Power Interface	- 3-pin Terminal Block : V+, V-, Frame Ground - 4-pin Mini-DIN
Ignition Control	16-mode Software Ignition Control
Remote Switch	3-pin Terminal Block

Others

TPM	Infineon SLB9670 supports TPM 2.0, SPI Interface
Watchdog Timer	Reset : 1 to 255 sec./min. per step
Smart Mgmt.	Wake on LAN, PXE supported
HW Monitor	Monitoring temperature, voltages. Auto throttling control when CPU overheats.

Mechanical

Dimension	260.0mm x 175.0mm x 79.0mm (10.24" x 6.89" x 3.11")
Weight	3.8 kg (8.38 lb)
Mounting	- Wallmount by mounting bracket - DIN Rail Mount (Optional) - 2U Rackmount (Optional)

Environment

Operating Temperature	35W TDP CPU : -40°C to 75°C (-40°F to 167°F), Fanless 65W TDP CPU : -40°C to 55°C (-40°F to 131°F), Fanless 2.5G Series : -40°C to 70°C (-40°F to 158°F), Fanless 10G Series : 0°C to 50°C (32°F to 122°F), with Internal Fan
Storage Temperature	-40°C to 85°C (-40°F to 185°F)
Humidity	5% to 95% Humidity, non-condensing
Relative Humidity	95% @75°C
Shock	- IEC 60068-2-27 - SSD : 50G @wallmount, Half-sine, 11ms
Vibration	- IEC 60068-2-64 - SSD : 5Grms, 5Hz to 500Hz, 3 Axis
EMC	CE, FCC, EN50155, EN50121-3-2