ECX-3000 PEG | Compact AI Computing System
Rugged Compact Industrial Edge AI Computer with Nvidia GPU
Features
- Workstation-grade Platform : Intel® Core™ i9/i7/i5/i3 Processor (14th gen, codename : RPL-S Refresh/RPL-S/ADL-S) running with Intel® R680E PCH supports max 65W TDP CPU
- Supports outstanding AI computing productivity by NVIDIA®/AMD graphics card, up to 200W power budget
- USB 3.2 Gen 2x2 offers a max speed of 20Gbps data transfer
- DC 12V to 50V wide range power input, Software Ignition Control
- 4 Independent 2.5GigE LAN IEEE 802.3at PoE+, 2 GigE LAN
- Supports multiple 5G/WiFi/BT/4G/LTE/GPRS/UMTS
- Supports Intel® vPro, TCC, Time-Sensitive Networking (TSN), and TPM 2.0
- Storage : 4 front-access 2.5" SSD Tray, M.2 Key M
Overview
Workstation-grade Platform : Intel® Core™ i9/i7/i5/i3 Processor (14th gen, codename : RPL-S Refresh/RPL-S/ADL-S) and running with Intel® R680E Chipset, Vecow ECX-3000 PEG Series delivers workstation-grade performance, with up to 36% CPU performance improved. The series is equipped with up to 4 PCIe expansion slot that supports max 200W power of NVIDIA® or AMD graphics engine and allows for expansions with 1 Mini PCIe and 2 M.2. Support for PCIe 4.0 and DDR5 4800HMz memory up to 64GB, Vecow ECX-3000 PEG Series offers a robust combination of performance and flexibility to facilitate AIoT applications such as Robotic Control, Smart Manufacturing, In-Vehicle Computing, and any Edge AI applications.
Specifications
System Processor - 24-core Intel® Core™ i9/i7/i5/i3 Processor (14th gen, Raptor Lake-S Refresh)
- 24-core 13th Gen Intel® Core™ i9/i7/i5/i3 Processor (Raptor Lake-S)
- 16-core 12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Alder Lake-S)
Chipset Intel® R680E Chipset BIOS AMI SIO IT8786E Memory 2 DDR5 4800MHz SO-DIMM, up to 64GB OS Windows 11, Windows 10, Linux I/O Interface Serial 4 COM RS-232/422/485 USB - 6 USB 3.2 Gen 2, USB Type A Connector
- 1 USB 3.2 Gen 2x2, USB Type C Connector supports
max 20Gbps data transfer (15W, 5V/3A)
Isolated DIO 32 Isolated DIO (16 DI, 16 DO) LED Power, HDD, PoE, WLAN SIM Card 3 External Nano SIM Card Socket RTC Battery 1 Front-access RTC Battery Expansion Mini PCIe 1 Mini PCIe sockets for PCIe/USB/SIM Card PCIe 4 PCIe Slot :
- 2 PCIe x16 Slot with x8 signal
- 2 PCIe x8 Slot with x4 signal
M.2 - 1 M.2 Key B Socket (3042/2280, PCIe/USB 3, default/USB 2)
- 1 M.2 Key B Socket (3052/2280, PCIe/USB 3, default/USB 2)
- 1 M.2 Key E Socket (2230, PCIe/USB)
Graphics Graphics Processor Intel® UHD Graphics 770/730 driven by Intel® Xe Architecture Interface - 1 DVI-I : Up to 1920 x 1080 @60Hz
- 1 HDMI : Up to 1920 ×1080 @60Hz
- 2 DisplayPort : Up to 7680 x 4320 @60Hz/5120 x 2880 @60Hz
- By requested Graphics Card
Storage SATA 4 SATAIII (6Gbps) support software RAID 0,1,5,10 M.2 1 M.2 Key M Socket (2280, PCIe x4) Storage Device 4 Front-access 2.5"SSD/HDD Tray Audio Audio Codec Realtek ALC888S-VD, 7.1 Channel HD Audio Audio Interface 1 Mic-in, 1 Line-out Ethernet LAN 1 Intel® I219LM GigE LAN LAN 2 Intel® I210 GigE LAN PoE LAN 3 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226, RJ45 Connector LAN 4 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226, RJ45 Connector LAN 5 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226, RJ45 Connector LAN 6 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226, RJ45 Connector Power Power Input DC 12V to 50V Power Interface 3-pin Terminal Block : V+, V-, Frame Ground Ignition Control 16-mode Software Ignition Control Remote Switch 3-pin Terminal Block Others TPM Infineon SLB9670 supports TPM 2.0, SPI Interface Watchdog Timer Reset : 1 to 255 sec./min. per step Smart Management Wake on LAN, PXE supported HW Monitor Monitoring temperature, voltages. Auto throttling control when CPU overheats. Mechanical Dimension 260mm x 240mm x 142mm (10.24"x9.45"x5.59") Weight 7.5 kg (16.53 lb) Mounting - Wallmount by mounting bracket
- VESA Mount (Optional), Rackmount (Optional)
Environment Operating Temperature -20°C to 45°C (-4°F to 113°F), with System Fan Storage Temperature -40°C to 85°C (-40°F to 185°F) Humidity 5% to 95% Humidity, non-condensing Relative humidity 95% at 45°C Shock/Vibration Operating, MIL-STD-810G, Procedure I EMC CE, FCC, EN50155, EN50121-3-2