EAC-5000 (GMSL2 or PoE) | Rugged NVIDIA Jetson AGX Orin
Features
Advanced NVIDIA® Jetson AGX Orin™ platform delivers up to 275 TOPS AI performance
Latest NVIDIA Ampere™ architecture, featuring with 2048 NVIDIA® CUDA® cores and 64 Tensor cores
Supports 8 GMSL 1/2 automotive cameras with Fakra-Z connectors OR 4 PoE+
1 PCIe Gen4 x8 expansion slot supports optional multiple 10GigE/PoE LAN/USB connections
2 Isolated CAN Bus support Flexible Data-rate, 2 COM RS-232/422/485
2 GigE LAN, 5 USB 3.1, 1 Digital Display supports 4K60
Support disaster recovery by Out-of-Band management
DC 9V to 50V wide range power input, Ignition Power Control
Overview
Vecow EAC-5000-OOB Series is powered by NVIDIA Jetson AGX Orin platform that features an Arm® Cortex®-A78AE CPU delivering up to 275 TOPS of AI performance and integrates an advanced NVIDIA Ampere architecture GPU with 64 Tensor Cores. It’s capable of delivering server-class performance for edge AI applications. EAC-5000-OOB Series has integrated with OOB (Out-of-Band) remote management operation technology and brings powerful disaster recovery service onto the Edge AI applications. As a hardware-based technology, the Out-of-Band management helps service providers effortlessly power ON/OFF devices remotely and bring unresponsive systems back to a working state.
Specifications
System
CPU
EAC-5000/5100-R32 : 8-core Arm® Cortex®-A78AE v8.2 64-bit CPU
EAC-5000/5100-R64 : 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU
GPU
EAC-5000/5100-R32 : 1792-core NVIDIA Ampere™ architecture GPU with 56 Tensor Cores
EAC-5000/5100-R64 : 2048-core NVIDIA Ampere™ architecture GPU with 64 Tensor Cores
DL Accelerator
2x NVDLA Engines
Memory
EAC-5000/5100-R32 : 1 32GB LPDDR5 DRAM
EAC-5000/5100-R64 : 1 64GB LPDDR5 DRAM
Software Support
- Linux
- NVIDIA JetPack SDK
I/O Interface
USB
- 1 USB 3.2 Gen 2
- 4 USB 3.1
Serial
2 COM RS-232/422/485
CAN Bus
2 Isolated CAN Bus support CAN FD
DIO
16 Isolated DIO (8 DI, 8 DO)
Micro USB
- 1 Micro USB console debug port
- 1 Micro USB OS flash port
Button
- 1 Power Button
- 1 Force Recovery Button
- 1 Reset Button
LED
Power, SSD, 2 User Programmable
SIM
2 SIM Card Socket
Antenna
6 Antenna for WiFi/4G/5G/LTE/GPRS/UMTS
Expansion
PCIe
1 PCIe x16 slot with PCIe 3.0 x8 signal
M.2
- 1 M.2 Key B Socket (3042/3052, USB3)
- 1 M.2 Key E Socket (2230, PCIe/USB)
Graphics
Interface
1 Digital Display, up to 4K60
Video Encode
EAC-5000/5100-R32 : 1x 4K @60, 3x 4K @30, 6x 1080p @60, 12x 1080p @30 (HEVC) EAC-5000/5100-R64 : 2x 4K @60, 4x 4K @30, 8x 1080p @60, 16x 1080p @30 (HEVC)
Video Decode
EAC-5000/5100-R32 : 1x 8K @30, 2x 4K @60, 4x 4K @30, 9x 1080p @60, 18x 1080p @30 (HEVC) EAC-5000/5100-R64 : 1x 8K @30, 3x 4K @60, 7x 4K @30, 11x 1080p @60, 22x 1080p @30 (HEVC)
Camera (EAC-5000)
GMSL
8 Fakra-Z connectors for GMSL 1/2 automotive cameras
Storage
M.2
2 M.2 Key M Socket (2280, PCIe Gen3 x4)
eMMC
1 eMMC 5.1, 64GB
SD
1 Micro SD (External)
Ethernet
LAN 1
10/100/1000 Base-T Ethernet GigE LAN, RJ45 Connector
(Optional X-coded M12 Connector)
LAN 2
10/100/1000 Base-T Ethernet GigE LAN, RJ45 Connector
(Optional X-coded M12 Connector)
PoE (EAC-5100)
LAN 3
IEEE 802.3at (25.5W/48V) GigE PoE+ LAN, RJ45 Connector (Optional X-coded M12 Connector)
LAN 4
IEEE 802.3at (25.5W/48V) GigE PoE+ LAN, RJ45 Connector (Optional X-coded M12 Connector)
LAN 5
IEEE 802.3at (25.5W/48V) GigE PoE+ LAN, RJ45 Connector (Optional X-coded M12 Connector)
LAN 6
IEEE 802.3at (25.5W/48V) GigE PoE+ LAN, RJ45 Connector (Optional X-coded M12 Connector)
Total PoE power budget support up to 60W at 25°C, 30W at 70°C
Power
Power Input
DC 9V to 50V
Power Interface
3-pin Terminal Block : V+, V-, Frame Ground
Ignition Control
16-mode Software Ignition Control
Remote Switch
3-pin Remote Switch Terminal Block
OOB Management
MCU
Nuvoton NUC980
Interface
OOB LAN, 10/100Mb Ethernet LAN, RJ45 Connector
Remote Management
Support Remote Power ON/OFF, Reset and Power Cycling
Mechanical
Dimensions
260 mm x 182 mm x 69 mm (10.24"x 7.17" x 2.72")
Weight
3.8 kg (8.39 lb)
Mounting
- Wallmount by mounting bracket
- DIN Rail Mount (Optional)
Environment
Operating Temperature
30W TDP Mode: -25°C to 70°C (-13°F to 158°F), with 0.63 m/s air flow
40/50W TDP Mode: -25°C to 55°C (-13°F to 131°F), with 0.63 m/s air flow
Storage Temperature
-40°C to 85°C (-40°F to 185°F)
Humidity
5% to 95% Humidity, non-condensing
Relative Humidity
95% @ 70°C
Shock
Operating, MIL-STD-810G, Method 516.7, Procedure I
Vibration
Operating, MIL-STD-810G, Method 514.6, Procedure I, Category 4
EMC
CE, FCC, EN50155, EN50121-3-2