EAC-4000 | Rugged NVIDIA Jetson Orin NX/Nano
Features
NVIDIA Jetson Orin™ NX/Nano, up to 100 TOPS AI performance (Orin Nano Super Mode Supported)
Up to 16GB LPDDR5 RAM, 128GB NVMe SSD
1 GigE LAN, 4 USB 3.1, 1 HDMI 2.0
2 COM RS-232/422/485
1 Full-size Mini PCIe with SIM for 4G/Wi-Fi/BT
Optional Allxon OOB Support
Overview
The Vecow EAC-4000 is powered by NVIDIA® Jetson Orin™ NX/Nano platform (Orin Nano Super Mode Supported), featuring 1024 cores NVIDIA Ampere™ architecture GPU with 32 Tensor cores and 8-core Arm® Cortex®-A78AE CPU. With a max of 16GB LPDDR5 and 2 NVDLA engines, the EAC-4000 provides up to 100 TOPS of AI performance. The compact EAC-4000 includes 1 GigE LAN, 4 USB ports, 1 HDMI port and 2 COM RS-232/422/485 ports, making it ideal for space-constrained applications such as Traffic vision, AOI, Delivery Robot and other advanced Edge AI applications.
Furthermore, the EAC-4000 Series supports the NVIDIA JetPack™ 6 software development kit, which expands the Jetson platform’s flexibility and scalability to accelerate AI application deploymen
Specifications
System
CPU
EAC-4000-XR16 : 8-core Arm® Cortex®-A78AE v8.2 64-bit CPU
EAC-4000-XR08/EAC-4000-AR08/EAC-4000-AR04 : 6-core Arm® Cortex®-A78AE v8.2 64-bit CPU
GPU
EAC-4000-XR16/EAC-4000-XR08/EAC-4000-AR08 :
NVIDIA Ampere™ architecture w/1024 NVIDIA® CUDA® cores, 32 Tensor cores
EAC-4000-AR04 : NVIDIA Ampere™ architecture w/512 NVIDIA® CUDA® cores, 16 Tensor cores
DL Accelerator
EAC-4000-XR16 : 2 NVDLA Engines
EAC-4000-XR08 : 1 NVDLA Engines
EAC-4000-AR08/EAC-4000-AR04 : None
Memory
EAC-4000-XR16 : 1 LPDDR5 DRAM, 16GB
EAC-4000-XR08/EAC-4000-AR08 : 1 LPDDR5 DRAM, 8GB
EAC-4000-AR04 : 1 LPDDR5 DRAM, 4GB
Software Support
- Linux
- NVIDIA JetPack SDK
I/O Interface
USB
4 USB 3.1 Type A
Micro USB
1 Micro USB Flash Port
Button
- 1 Power Button
- 1 Force Recovery Button
- 1 Reset Button
LED
Power, SSD
SIM
1 Nano SIM Card Socket
Antenna
2 Antenna for WiFi/4G
Serial
2 COM RS-232/422/485
Expansion
Mini PCIe
1 Mini PCIe (Full-size, PCIe, USB 2.0)
Graphics
Interface
1 HDMI 2.0, up to 4K@60
Video Encode
EAC-4000-XR16/EAC-4000-XR08 :
- HEVC : 1x 4K @60, 3x 4K @30, 6x 1080p @60, 12x 1080p @30
- H.264 : 1x 4K @60, 2x 4k @30, 5x 1080p @60, 11x 1080p @30
Video Decode
EAC-4000-XR16/EAC-4000-XR08 :
- HEVC: Up to 1x 8K @30, 2x 4K @60, 4x 4K @30, 9x 1080p @60, 18x 1080p @30
- H.264: Up to 1x 4K @60, 2x 4K @30, 5x 1080p @60, 11x 1080p @30
EAC-4000-AR08/EAC-4000-AR04 :
- HEVC: Up to 1x 4K @60, 2x 4K @30, 5x 1080p @60, 11x 1080p @30
- H.264: Up to 1x 4K @30, 3x 1080p @60, 7x 1080p @30
Storage
M.2
1 M.2 Key M Socket (2242, PCIe 4.0 x4)
Ethernet
LAN
10/100/1000 Base-T GigE LAN, RJ45 Connector
Power
Power Input
12V DC Power Input
Power Interface
3-pin Terminal Block : V+, V-, Frame Ground
Others
OOB
Out-of-band mgmt by Nuvoton NUC980 (Optional, by Module)
TPM
Infineon SLB9673 supports TPM 2.0 (Optional)
Mechanical
Dimensions
112 x 103 x 45 mm
Weight
0.6 kg (1.32 lb)
Mounting
- Wallmount
- DIN Rail (Optional)
Environment
Operating Temperature
15W TDP Mode : -25°C to 55°C, with 0.63 m/s air flow
25W TDP Mode : -25°C to 45°C, with 0.63 m/s air flow
Storage Temperature
-40°C to 85°C (-40°F to 185°F)
Humidity
5% to 95% Humidity, non-condensing
Relative Humidity
95% @55°C
Shock
Operating, MIL-STD-810G, Method 516.7, Procedure I
Vibration
Operating, MIL-STD-810G, Method 514.6, Procedure I, Category 4
EMC
CE, FCC, EN50155, EN50121-3-2, EN62368-1, MIL-STD-810G